| 摘要 |
<p>An apparatus for cleaning a wafer according to an embodiment of the present invention comprises: a cleaning bath; a main piping which is connected to the cleaning bath; a first inlet pipe which is connected to the main piping and supplies a first cleaning fluid; a second inlet pipe which is connected to the main piping and supplies a second cleaning fluid; a first discharging pipe which is connected to the first inlet pipe and discharges the first cleaning fluid flowing in the first inlet pipe; and a second discharging pipe which is connected to the second inlet pipe and discharges the second cleaning fluid flowing in the second inlet pipe, and when supplying the first cleaning fluid to the cleaning bath through the main piping, the first inlet pipe and the second discharging pipe are opened, the first discharging pipe and the second inlet pipe are closed, the first cleaning fluid is supplied from the first inlet pipe to the main piping, and the second cleaning fluid is discharged from the second inlet pipe to the second discharging pipe.</p> |
