COMPOSITION FOR METAL ELECTROPLATING COMPRISING LEVELING AGENT

摘要

A composition comprising a source of metal ions and at least one additive comprising at least one polyaminoamide, said polyaminoamide comprising the structural unit represented by formula I or derivatives of the polyaminoamide of formula I obtainable by complete or partial protonation, N-functionalization or N-quaternization with a non-aromatic reactant, wherein D6 is, for each repeating unit 1 to s independently, a divalent group selected from a saturated or unsaturated C1-C20 organic radical, D7 is, for each repeating unit 1 to s independently, a divalent group selected from straight chain or branched C2-C20 alkanediyl, which may optionally be interrupted by heteroatoms or divalent groups selected from O, S and NR10, R1 is, for each repeating unit 1 to s independently, selected from H, C1-C20 alkyl, and C1-C20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl, or, together with R2, may form a divalent group D8, and R2 is, for each repeating unit 1 to s independently, selected from H, C1-C20 alkyl, and C1-C20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl, or, together with R1, may form a divalent group D8, and D8 is selected from straight chain or branched C1-C18 alkanediyl, which may optionally be interrupted by heteroatoms or divalent groups selected from O, S and NR10, s is an integer from 1 to 250, R10 is selected from H, C1-C20 alkyl, and C1-C20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl.