发明名称 RESIN MOLDING APPARATUS AND RESIN MOLDING METHOD
摘要 The present invention relates to an apparatus for molding resin, which easily moves a resin returning tool and can select a resin material and a resin supplying tool based on a product. The apparatus includes: a movable lower mold; a molding frame including a movable lower mold and a fixed upper mold; a cavity arranged on the movable lower mold; the resin supplying tool which supplies a raw resin material to the cavity; a resin storing tool which stores a resin material; the resin returning tool integrated with the resin supplying tool and the resin storing tool; and an attachable/detachable molding module including the molding frame. The integrated resin returning tool is moved in an easy manner. A liquid resin or a solid resin can be selected as the resin material. A first liquid type or a second liquid mixed type can be selected as the liquid resin. One substrate or multiple substrates before sealing in each molding module can be sealed with a resin. Therefore, the number of molded products can be increased or reduced.
申请公布号 KR20150071641(A) 申请公布日期 2015.06.26
申请号 KR20140172791 申请日期 2014.12.04
申请人 TOWA CORPORATION 发明人 YAMADA TETSUYA;GOTO TOMOYUKI;TAKADA JUNKO;FUJIWARA NAOMI;IWATA YASUHIRO
分类号 B29C39/24;B29C31/04 主分类号 B29C39/24
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