发明名称 |
RETRAIT DU BORD DE LA RONDELLE DE CENTRAGE LORS D'UN PROCEDE DE GRAVURE PAR IMMERSION |
摘要 |
<p>A method of performing immersion lithography on a semiconductor wafer is provided. The method includes providing a layer of resist onto a surface of the semiconductor wafer. Next, an edge-bead removal process spins the wafer at a speed greater than 1000 revolutions per minute and dispenses solvent through a nozzle while the wafer is spinning. Then, the resist layer is exposed using an immersion lithography exposure system.</p> |
申请公布号 |
FR2888401(B1) |
申请公布日期 |
2015.06.26 |
申请号 |
FR20060005776 |
申请日期 |
2006.06.27 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO.,LTD. |
发明人 |
CHANG CHING YU;KE CC;YU VINCENT |
分类号 |
H01L21/3105;G03F7/20 |
主分类号 |
H01L21/3105 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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