| 发明名称 |
Semiconductor component with chip for the high-frequency range |
| 摘要 |
The invention relates to a semiconductor component with a chip, especially with a high-frequency switching circuit. The semiconductor component further comprises a metal body on the chip and a supplementary circuit board. The supplementary circuit board is provided on an underside facing away from the metal body for connection with a printed-circuit board by means of reflow soldering. |
| 申请公布号 |
US2015181712(A1) |
申请公布日期 |
2015.06.25 |
| 申请号 |
US201414576442 |
申请日期 |
2014.12.19 |
| 申请人 |
Rohde & Schwarz GmbH & Co. KG |
发明人 |
Hageneder Daniel;Kappels Martin |
| 分类号 |
H05K1/18;H01L23/04;B23K1/00;H05K1/02;H05K3/34;H01L23/00;H05K1/14 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor component, comprising
a metal body on at least one chip and a supplementary circuit board, wherein the supplementary circuit board is provided on an underside facing away from the metal body for connection with a printed-circuit board by operations including soldering. |
| 地址 |
Munich DE |
