发明名称 ELECTRONIC SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide an electronic substrate which inhibits deterioration in connection reliability. ! SOLUTION: An electronic substrate (100) includes a connector (30) surface mounted on a wiring board (10) via a solder (50). The connector has a terminal (31), a holder (32) and a peg (33). The peg has a first plate part (34) fastened to the holder and a second plate part (35) fastened to the wiring board. A central part (36) of the second plate part faces a mounting surface (11a) of the wiring board and an edge (37) of the second plate part is bent to be orthogonal to the mounting surface and separates from the mounting surface further than the central part. The central part and the wiring board are fastened to each other by a solder formed in a shape corresponding to a space formed between the central part and the wiring board. The edge and the wiring board are fastened to each other by a convex meniscus-shaped solder which protrudes from the space between the central part and the wiring boar
申请公布号 JP2015118872(A) 申请公布日期 2015.06.25
申请号 JP20130262899 申请日期 2013.12.19
申请人 DENSO CORP 发明人 MATSUURA SATOSHI ; NINOMIYA NOBUYUKI
分类号 H01R12/71 主分类号 H01R12/71
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