发明名称 CHIP ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a chip electronic component and a method for manufacturing the chip electronic component.SOLUTION: The present invention provides a chip electronic component including: a magnetic body including an insulation substrate; an internal coil part formed on at least one surface of the insulation substrate; and an external electrode formed on one end surface of the magnetic body and connected to the internal coil part. The internal coil part includes a first coil pattern formed on the insulation substrate and a second coil pattern formed on the first coil pattern. The width of the second coil pattern is formed to be narrower than that of the first coil pattern.
申请公布号 JP2015119158(A) 申请公布日期 2015.06.25
申请号 JP20140083687 申请日期 2014.04.15
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 JEONG DONG JIN
分类号 H01F17/00;H01F41/04 主分类号 H01F17/00
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