| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser welding method and a laser welding jig capable of enhancing bond strength of a welded part, and to provide a semiconductor device using the method.SOLUTION: The laser welding method includes: pressing with a plurality of claws 39, which are pressing parts of a laser welding jig 100 to make a gap 10 between a first member 1 to be welded, which is a first member, and a second member 2 to be welded, which is a second member to be equal to or less than 300 μm; and irradiating the second member 2 to be welded at a portion sandwiched by the claws 39 with a laser beam 35 to laser-weld the two members 1, 2. |
