METHOD FOR MANUFACTURING TOUCH PANEL

摘要

A method for manufacturing a touch panel includes the following procedures. A base plate is provided. An indium tin oxide film is formed on the base plate. The indium tin oxide film is etched to form a plurality of first and second electrodes which are alternatively arranged according to columns on the base plate and insulated from each other, and the first electrodes in a column along a first direction are electrically coupled to each other. A plurality of insulated layers is formed on the first and second electrodes. A plurality of conductive connectors are formed on the plurality of insulated layers via an ink jet printing method to electrically interconnect with the second electrodes in a column along the second direction intersecting the first direction. The widths of the conductive connectors are reduced below 10 μm via a laser processing method.

主权项

1. A method for manufacturing a touch panel, the method comprising:
providing a base plate; forming an indium tin oxide film on the base plate; etching the indium tin oxide film to form a plurality of first and second electrodes which are alternatively arranged according to columns on the base plate and insulated from each other, the first electrodes in a column along a first direction being electrically coupled to each other, the second electrodes in a column along a second direction intersecting the first direction having separated patterns; forming a plurality of insulated layers on the plurality of first and second electrodes, each insulated layer overlapping a portion of each two neighboring second electrodes in a column along the second direction and a portion of each two first electrodes positioned adjacent to the two neighboring second electrodes; forming a plurality of conductive connectors on the plurality of insulated layers via an ink jet printing method to electrically interconnect with the second electrodes in a column along the second direction; and diminishing the widths of the plurality of conductive connectors below 10 μm via a laser processing method.