| 发明名称 |
BUILD-UP INSULATING FILM, PRINTED CIRCUIT BOARD INCLUDING EMBEDDED ELECTRONIC COMPONENT USING THE SAME AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
Disclosed herein are a build-up insulating film, a printed circuit board including an embedded electronic component using the same and a method for manufacturing the same.;The build-up insulating film according to the present invention includes: a build-up film layer; and an adhesion layer formed on the other surface of the build-up film layer, wherein the adhesion layer is formed by mixing at least one selected from epoxy-based, silicone-based, polyimide-based, urethane-based and ceramic-based materials. |
| 申请公布号 |
US2015181705(A1) |
申请公布日期 |
2015.06.25 |
| 申请号 |
US201414326706 |
申请日期 |
2014.07.09 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
SEO Dae Seok |
| 分类号 |
H05K1/03;H05K3/00;B32B27/36;H05K1/18;C09J7/02;H05K3/30;H05K13/04 |
主分类号 |
H05K1/03 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A build-up insulating film comprising:
a build-up film layer; and an adhesion layer formed on the other surface of the build-up film layer, wherein the adhesion layer is formed by mixing at least one selected from epoxy-based, silicone-based, polyimide-based, urethane-based and ceramic-based materials. |
| 地址 |
Suwon-Si KR |
