SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can reduce the possibility of damages on a laminate of semiconductor substrates when dividing the laminate. ! SOLUTION: A semiconductor device manufacturing method comprises: a process of preparing semiconductor substrates 11 and a multilayer substrate; a process of performing division processing between regions where semiconductor chips are formed, respectively of a principal surface of the multilayer substrate; a process of preparing a support medium and temporarily fixing the multilayer substrate with the principal surface facing the support medium side; a process of thinning the multilayer substrate to create a state where a plurality of semiconductor chips are arranged on the support medium after division; a process of fastening back faces of the plurality of semiconductor chips 110 arranged on the support medium to a principal surface of the semiconductor substrate; a process of removing the support medium; a process