LOW Z-HEIGHT PACKAGE ASSEMBLY

摘要

In embodiments, a package assembly may include a die coupled with one or more conductive pads. A barrier layer may be directly coupled with and between the die and one or more of the conductive pads. The package assembly may further include a solder resist layer coupled with the die and the conductive pads, and one or more interconnects positioned at least partially within the solder resist layer and directly coupled with one or more of the conductive pads.

主权项

1. A package assembly comprising:
a die having a first side and a second side opposite the first side, wherein the die includes one or more traces on the first side; one or more pads, wherein individual pads of the one or more pads have a first side and a second side opposite the first side, and wherein the first side of the individual pads is coupled with the first side of the die; and a barrier layer directly coupled with the first side of the individual pads and disposed between the first side of the individual pads and the first side of the die.