| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-conductive sheet for a semiconductor module having an epoxy resin layer with excellent thermal conductivity. ! SOLUTION: In a conductive sheet for a semiconductor module, an epoxy resin layer is formed with a composition including an epoxy monomer having a specific structure, a phenolic curative having a specific structure and boron nitride particles or aluminum nitride particles. The boron nitride particles or aluminum nitride particles are contained in a state of agglomerated particles. The epoxy composition further includes an onium salt-based hardening accelerator. ! COPYRIGHT: (C)2015,JPO&INPIT |
