| 摘要 |
The present invention is a resin paste composition which contains (A) a (meth)acrylic compound, (B) a binder resin, (C) an amine compound, (D) a polymerization initiator, (E) a flexibility-imparting agent, (F) a silver powder and (G) an aluminum powder. The silver powder (F) contains a silver powder (F-1) that is coated with stearic acid and has a tap density of 4.0 g/cm3 or less. The content of the silver powder (F) is 42% by mass or less, and the content of the silver powder (F-1) is 11% by mass or more. The mass ratio of the content of the aluminum powder (G) to the content of the silver powder (F) is 0.3-2.3. The present invention is able to provide a low-cost resin paste composition that exhibits excellent electrical conductivity, excellent thermal conductivity and excellent adhesiveness, while reducing the amount of silver used therein, which is rare and expensive. This resin paste composition is suitable for use in bonding of a conductor element such as a semiconductor chip with a supporting member such as a lead frame. The present invention is also able to provide a semiconductor device which uses this resin paste composition. |
