| 摘要 |
The purpose of the present invention is to cancel a pressure difference caused by a thermo-compression bonding head to improve the reliability of connections even in an electronic component wherein an input bump region and an output bump region have different surface areas and are disposed asymmetrically. On a side (2) for mounting onto a circuit board (14), an output bump region (4), in which output bumps (3) are arranged, is provided nearby one side (2a) among an opposing pair of edges, and an input bump region (6), in which input bumps (5) are arranged, is provided nearby the other side (2b) of the pair of edges. The output bump region (4) and the input bump region (6) have different surface areas and are disposed asymmetrically on the side (2) for mounting. Among the output bump region (4) and the input bump region (6), the region with a relatively large surface area is formed inward from the one or the other edge (2a, 2b) nearby, by a distance of at least 4% of a width W between the pair of edges. |
