| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method for a wafer, by which the possibility of failure in die bonding step can be reduced. ! SOLUTION: A processing method for a wafer in which a device is formed in each of areas formed on the surface of the wafer and separated by a plurality of dividing lines intersecting one another comprises: a tape sticking step in which a dicing tape is stuck to the back of a wafer via a die bonding film; a holding step in which, after the tape sticking step, the wafer is held on a chuck table via the dicing tape; a cutting step in which the wafer held on the chuck table is cut from its surface to the dicing tape by a cutting blade, and separating grooves are formed for separating the wafer and the die bonding film by cutting them along the dividing lines and a heat emitting step in which after the cutting step, heat is applied along the cutting grooves and thereby a whisker-like burr of the die bonding film caused in the cutting step is melted to the minimum. ! COPYRIG |
