| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board in which both high wiring density in the printed wiring board and heat transfer performance of the printed wiring board are satisfied, and to provide a manufacturing method therefor. ! SOLUTION: A step for "forming an unfilled non-through hole by laser boring, and then filling the hole by conduction plating" is performed a plurality of times for at least an insulating substrate composing a printed wiring board, and a plurality of non-through conduction holes, i.e., via holes, are arranged in adjacent state. ! COPYRIGHT: (C)2015,JPO&INPIT |
