| 发明名称 |
FLIP-CHIP PACKAGING STRUCTURE |
| 摘要 |
A flip-chip packaging structure is provided, which includes: a packaging substrate having a substrate body and a circuit layer formed on the substrate body, wherein the circuit layer has a plurality of conductive pads embedded in the substrate body and exposed from a surface of the substrate body; and a chip disposed on and electrically connected to the packaging substrate through a plurality of conductive elements, wherein the conductive elements and the exposed portions of the conductive pads have a width ratio in a range of 0.7 to 1.3, thereby improving the product yield and reliability. |
| 申请公布号 |
US2015179598(A1) |
申请公布日期 |
2015.06.25 |
| 申请号 |
US201414183896 |
申请日期 |
2014.02.19 |
| 申请人 |
Siliconware Precision Industries Co., Ltd |
发明人 |
Chiu Shih-Chao;Hung Liang-yi |
| 分类号 |
H01L23/00;H01L23/28 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A flip-chip packaging structure, comprising:
a packaging substrate having a substrate body and a circuit layer formed on the substrate body, wherein the circuit layer has a plurality of conductive pads embedded in the substrate body and exposed from a surface of the substrate body; and a chip disposed on and electrically connected to the packaging substrate through a plurality of conductive elements, wherein the conductive elements and the exposed portions of the conductive pads have a width ratio in a range of 0.7 to 1.3. |
| 地址 |
Taichung TW |
