SOLID-STATE IMAGING APPARATUS AND METHOD OF MANUFACTURING THE SAME

摘要

A method of manufacturing a solid-state imaging apparatus is provided. The method includes forming, above a substrate having an effective pixel region and a non-effective pixel regions, a structure including first and second members located above the effective and non-effective pixel regions respectively, and a third member covering the first and second members, forming, above the third member, a mask having first and second apertures located above the first and second members respectively, and forming a first hole exposing the first member by etching the structure through the first aperture and a second hole exposing the second member by etching the structure through the second aperture. In the etching, the first and second holes are concurrently formed and etching of the structure is finished based on that the second hole has reached the second member.

主权项

1. A method of manufacturing a solid-state imaging apparatus, the method comprising:
forming, above a substrate having an effective pixel region and a non-effective pixel region, a structure including a first member located above the effective pixel region, a second member located above the non-effective pixel region, and a third member covering the first member and the second member; forming, above the third member, a mask having a first aperture located above the first member and a second aperture located above the second member; and forming a first hole exposing the first member in the structure by etching the structure through the first aperture, and a second hole exposing the second member in the structure by etching the structure through the second aperture, wherein in the etching, the first hole and the second hole are concurrently formed, and etching of the structure is finished based on that the second hole has reached the second member.