DESMEARING METHOD FOR WIRING BOARD MATERIALS, METHOD FOR PRODUCING WIRING BOARD MATERIAL AND COMPOSITE INSULATING LAYER-FORMING MATERIAL

摘要

The purpose of the present invention is to provide: a desmearing method for wiring board materials, which is capable of performing sufficient desmearing of the inside of a through hole that is formed in an insulating layer without requiring complicated steps, and which enables the insulating layer to have an adequate surface roughness; a method for producing a wiring board material which is subjected to this desmearing method; and a composite insulating layer-forming material which is used in this production method. A desmearing method according to the present invention is a method for desmearing a wiring board material that is obtained by laminating an insulating layer, which is formed of a resin containing a filler, on a conductive layer. This desmearing method for wiring board materials is characterized by comprising: a hole formation step wherein a hole that penetrates the insulating layer in the thickness direction is formed; and a desmearing step wherein the wiring board material after the hole formation step is processed with radicals. This desmearing method for wiring board materials is also characterized in that: the wiring board material subjected to the desmearing step is provided with an expendable resist layer on the insulating layer; and the expendable resist layer is formed of a resin that is expended in the desmearing step.