| 摘要 |
The invention relates to an apparatus (10) for the isolated application of solder material deposits (11), in particular solder balls, comprising a conveying device (19) for the solder material deposits to be conveyed individually from a solder material reservoir (12) to an application device (33), wherein the conveying device has transporting receptacles that are formed as through-holes and can each be moved from a receiving position, in which a solder material deposit is accepted from the solder material reservoir, into a transfer position P2, in which the solder material deposit is exposed to compressed gas and from which the solder material deposit is transferred into an application position P3 on an application opening (37) of an application mouthpiece (36) of the application device, wherein a first detector device (69), for triggering exposure of the solder material deposit arranged in the application position P3 to a laser radiation emitted by a laser device, and a second detector device (80), for localizing the solder material deposit, are provided. |
