Enhanced flip chip structure using copper column interconnect

摘要

A flip chip package includes a carrier coupled to a die. The carrier includes: at least a via, for coupling the surface of the carrier to electrical traces in the carrier; and at least a capture pad electrically coupled to the via, wherein the capture pad is plated over the via. The die includes: at least a bond pad formed on the surface of the die; and at least a copper column, formed on the bond pad for coupling the die to the capture pad on the carrier, wherein the copper column is disposed on one side of the capture pad about the via opening only.

主权项

1. A flip chip package comprising:
a carrier, comprising:
at least a via, for coupling the surface of the carrier to electrical traces in the carrier, wherein the via is open and unfilled; andat least a capture pad electrically coupled to the via, wherein the capture pad is plated over the via; and a die, coupled to the carrier, comprising:
at least a bond pad formed on the surface of the die; andat least a copper column, formed on the bond pad for coupling the die to the capture pad on the carrier, wherein the copper column is disposed on one side only of the capture pad, so the copper column is adjacent to but does not overlie the via opening.