| 发明名称 | Semiconductor device | ||
| 摘要 | A semiconductor device includes a semiconductor element, a base plate having an upper surface on which the semiconductor element is mounted, a cooling fin disposed on a lower surface of the base plate, a jacket disposed in a sealing manner on the lower surface of the base plate, the jacket surrounding the cooling fin, and a header partition wall formed separately from the jacket and fixed to the jacket on the lower side of the cooling fin in the jacket, the header partition wall forming a header and a flow path for causing a refrigerant flow to the cooling fin. | ||
| 申请公布号 | US9064846(B2) | 申请公布日期 | 2015.06.23 |
| 申请号 | US201414246475 | 申请日期 | 2014.04.07 |
| 申请人 | Mitsubishi Electric Corporation | 发明人 | Nagai Miho;Imoto Yuji;Usui Osamu |
| 分类号 | H01L23/34;H01L23/46 | 主分类号 | H01L23/34 |
| 代理机构 | Studebaker & Brackett PC | 代理人 | Studebaker & Brackett PC |
| 主权项 | 1. A semiconductor device, comprising: a semiconductor element; a base plate having an upper surface on which said semiconductor element is mounted; a cooling fin disposed on a lower surface of said base plate; a jacket disposed in a sealing manner on the lower surface of said base plate, said jacket surrounding said cooling fin; and a header partition wall formed separately from said jacket and fixed to said jacket on the lower side of said cooling fin in said jacket, said header partition wall forming a header and a flow path for causing a refrigerant flow to said cooling fin and exchangeable relative to the jacket that surrounds the cooling fin. | ||
| 地址 | Tokyo JP | ||