发明名称 Semiconductor device and manufacturing method thereof
摘要 A semiconductor device includes a substrate, and a gate electrode formed on the substrate on a gate insulation film. The semiconductor device also includes a source diffusion layer and a drain diffusion layer which are formed on the substrate where the gate electrode is sandwiched between the source diffusion layer and the drain diffusion layer, one or more source contacts formed on the source diffusion layer; and one or more drain contacts formed on the drain diffusion layer. At least one of the source contacts and the drain contacts includes a first contact region having a first size and a second contact region having a second size larger than the first size on the same source diffusion layer or on the same drain diffusion layer.
申请公布号 US9064843(B2) 申请公布日期 2015.06.23
申请号 US201313917989 申请日期 2013.06.14
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 Hamaguchi Masafumi
分类号 H01L29/40;H01L29/417;G06F17/50 主分类号 H01L29/40
代理机构 Patterson & Sheridan LLP 代理人 Patterson & Sheridan LLP
主权项 1. A manufacturing method of a semiconductor device, comprising: preparing design data for manufacturing a semiconductor device which comprises a first contact region having a first size; preparing a photo mask based on the design data, wherein N (N being an integer of 2 or more) first contact regions are replaced with one second contact region having a second size greater than the first size; and forming a semiconductor device having the first contact region and the second contact region formed on at least one of a common source diffusion layer and a common drain diffusion layer using the photo mask.
地址 Tokyo JP