| 发明名称 | Packaging methods and structures using a die attach film | ||
| 摘要 | Packaging methods and structures for semiconductor devices that utilize a novel die attach film are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer and forming a die attach film (DAF) that includes a polymer over the carrier wafer. A plurality of dies is attached to the DAF, and the plurality of dies is packaged. At least the carrier wafer is removed from the packaged dies, and the packaged dies are singulated. | ||
| 申请公布号 | US9064879(B2) | 申请公布日期 | 2015.06.23 |
| 申请号 | US201113228244 | 申请日期 | 2011.09.08 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Hung Jui-Pin;Lin Jing-Cheng;Liu Nai-Wei;Chang Chin-Chuan;Yu Chen-Hua;Jeng Shin-Puu;Kao Chin-Fu;Mao Yi-Chao;Lu Szu Wei |
| 分类号 | H01L21/44;H01L21/48;H01L21/50;H01L23/48;H01L23/52;H01L29/40;H01L21/56;H01L23/14;H01L23/498;H01L23/538;H01L21/683;H01L23/31;H01L23/00 | 主分类号 | H01L21/44 |
| 代理机构 | Slater & Matsil, L.L.P. | 代理人 | Slater & Matsil, L.L.P. |
| 主权项 | 1. A method of packaging a semiconductor device, the method comprising: providing a carrier wafer; forming a die attach film (DAF) over the carrier wafer, the DAF comprising a polymer; attaching a plurality of dies to the DAF; packaging the plurality of dies; removing at least the carrier wafer from the packaged dies; and singulating the packaged dies after removal of the carrier, each of the packaged dies retaining a segment of the die attach film after singulation. | ||
| 地址 | Hsin-Chu TW | ||