| 摘要 |
<p>The present invention relates to an aramid nanocomposite resin composition and a film using the same. The composition exhibits excellent properties such as tensile strength, modulus, resistance to organic solvents, thermal properties, low thermal expansion, and mechanical properties, and has a low dielectric constant, thereby being used as a material suitable for use as a flexible circuit board, a silicon wafer coating film, a multilayer printed circuit board comprising a protective film or an insulating film, a semiconductor laminate, a photosensitive organic insulating material for OLED devices, and a transparent display material, etc.</p> |
