Statistical method for monitoring manufacturing equipment and processing operations

摘要

A statistical process control method for monitoring and controlling semiconductor manufacturing processing operations is provided. For a chosen processing operation, multiple measurement sites are used to generate data of a measurable characteristic that is impacted by and associated with the processing operation. The data from the sites is compared over time and one or more outlier sites are identified. The outlier sites are the sites at which the data values are most divergent from the rest of the data. Algorithms are used to mathematically compare the outlier sites to the other sites to produce a comparative index. The comparative index is monitored graphically or otherwise to identify changes in the processing operation, and corrective actions are taken.

主权项

1. A method for monitoring a manufacturing operation, said method comprising:
performing multiple runs of a processing operation upon semiconductor substrates over time, said processing operation having a measurable impact on a characteristic of said semiconductor substrate; measuring said characteristic at a plurality of sites on said corresponding semiconductor substrate for each said run; identifying an outlier site of said plurality of sites wherein said measured characteristic has the largest or smallest average value over said runs; generating a comparative index comparing a value of said measured characteristics of said outlier site to a value of said measured characteristics of other sites of said plurality of sites, for each said run; performing further runs of said processing operation and measuring said characteristic at said outlier site and at said other sites for each said further run; and generating said comparative index for each said further run and monitoring said comparative index in time; and controlling said processing operation by adjusting a parameter thereof based on changes in said comparative index.