发明名称 |
Vertical electronic fuse |
摘要 |
An electronic fuse structure including a first Mx metal comprising a conductive cap, an Mx+1 metal located above the Mx metal, wherein the Mx+1 metal does not comprise a conductive cap, and a via, wherein the via electrically connects the Mx metal to the Mx+1 metal in a vertical orientation. |
申请公布号 |
US9064871(B2) |
申请公布日期 |
2015.06.23 |
申请号 |
US201414340633 |
申请日期 |
2014.07.25 |
申请人 |
International Business Machines Corporation |
发明人 |
Bao Junjing;Huang Elbert E.;Li Yan Zun;Moy Dan |
分类号 |
H01L23/52;H01L21/82;H01L23/525;H01L23/522;H01L21/768;H01L23/532 |
主分类号 |
H01L23/52 |
代理机构 |
|
代理人 |
Ivers Catherine;Kelly L. Jeffrey |
主权项 |
1. An electronic fuse structure comprising:
an Mx level comprising a first Mx metal and a second Mx metal embedded in an Mx dielectric, a top surface of the first Mx metal and a top surface of the second Mx metal are coplanar; an Mx+1 level immediately above the Mx level, the Mx+1 level comprising an Mx+1 metal embedded in an Mx+1 dielectric; a conductive cap covering an entire top surface of the first Mx metal and separating the top surface of the first Mx metal from a cap dielectric; the cap dielectric positioned between the Mx level and the Mx+1 level in direct contact with the entire top surface of the second Mx metal and covering a portion of a top surface and entire sidewalls of the conductive cap, and the cap dielectric having a substantially uniform thickness on the top surfaces of the first Mx metal and the second Mx metal; and a via electrically connecting the first Mx metal to the Mx+1 metal in a vertical orientation, the conductive cap separates the first Mx metal from the via. |
地址 |
Armonk NY US |