发明名称 CONDUCTIVE PASTE FOR FORMING CONDUCTIVE FILM OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To realize good fire-through even when decreasing a firing temperature when Se or Te, or a compound thereof is contained as an additive.SOLUTION: A conductive paste for forming a conductive film contains (A) a conductive powder, (B) at least one kind selected from the first group consisting of Se, Te, a compound containing Se and a compound containing Te, as a first additive, (C) a compound containing at least one kind of element selected from the second group consisting of V, Nb, Ta, Sb, Bi, Mn, Ge, Si and W, as a second additive, (D) glass frit, (E) an organic binder, and (F) a solvent.
申请公布号 JP2015113371(A) 申请公布日期 2015.06.22
申请号 JP20130254925 申请日期 2013.12.10
申请人 KYOTO ELEX KK 发明人 TAKAGI KAZUYA;NAKATANI SEIICHI;HARIGAE HIKOICHI;OCHIAI NOBUO;NAKAYAMA SHINJI;OTANI KAIRI;HAYASHIDA NOZOMU
分类号 C09D1/04;C09D5/24;C09D7/12;H01B1/00;H01B1/22;H01L31/04 主分类号 C09D1/04
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