| 摘要 |
The present invention relates to a method for testing wire bonding and an apparatus for testing wire bonding capable of efficiently determining whether boding is in good condition or not. The method for testing wire bonding for electrically connecting a lead frame set to a reference potential and a semiconductor device mounted on the lead frame using a wire includes: (a) lowering a bonding tool toward a predetermined electrode of a plurality of electrodes of a semiconductor device; (b) boding part of a wire to the predetermined electrode of the semiconductor device; (c) moving the boding tool along a predetermined trajectory while uncoiling the wire from the front end of the boding tool, and moving the part of the wire extended from the front end of the bonding tool up to an upper part of the lead portion of the lead frame; (d) boding the part of the wire to the lead portion of the lead frame; (e) cutting the wire; and (f), in the step (b) and/or (c), supplying, to a wire, an applied voltage having a reverse polarity to the voltage in a direction in which current flows forward to a portion of diode between a predetermined electrode to be bonded and a substrate portion of a semiconductor device. In the step (f), the method for testing wire bonding and the apparatus for testing wire bonding can determine whether the boding is in a good condition or not by detecting a voltage value based on current flowing according to potential difference between the applied voltage and the reference potential of the lead frame. |
