| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology capable of preventing occurrence of delamination on a wiring board with a multilayer structure. ! SOLUTION: A wiring board 100 comprises a core substrate 10 and build-up layers 21-24 which are laminated on both faces of the core substrate 10. Each of the build-up layers 21-24 includes resin layers 31, 32, 61 and 62 and wiring layers 41, 42, 71 and 72. In the first and second build-up layers 21 and 22 formed and disposed on a front face of the core substrate 10, at an outer peripheral side of the first and second wiring layers 41 and 42, a metal film 50 is provided which extends over entire outer peripheries of the first and second resin layers 31 and 32. The metal film 50 includes: a first portion 51 in surface-contact with a front face of an outer edge of the core substrate 10, a second portion 52 extending in a thickness direction of the resin layers 31 and 32; and a third portion 53 in surface-contact with surfaces of the resin layers 31 and 32. ! COPYRIGHT |
