SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To reduce the manufacturing cost by improving the electric performance, increasing the mutual connection density between a chip and a package, and saving the silicon area, thereby reducing the device cost in a semiconductor structure.SOLUTION: A semiconductor structure includes a device 100, a conductor pad 102 on the device 100, and an AgYalloy support 115 arranged on the conductor pad 102. The Y of the AgYalloy contains a metal forming a complete solid solution with Ag at an arbitrary mass percentage, and the X of the AgYalloy is in a range of about 0.005-0.25. Preferably, the Y contains at least one of Au and Pd. Preferably, the AgYalloy support 115 has a height of about 30-100μm.