发明名称 PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board capable of reducing an interval between conductors of neighboring conductive patterns while maintaining connection reliability. ! SOLUTION: The printed wiring board includes a base film containing a fluororesin as a main component and a conductive pattern laminated on a surface of the base film. The base film includes a modified layer in at least a region where the conductive pattern is present, on the surface, the modified layer contains a siloxane bond and a hydrophilic organic functional group and at a surface side of the base film, the modified layer is not present in a region around the conductive pattern. As a contact angle of the surface of the modified layer with pure water, an angle of 90° or less is preferable. As a contact angle of a surface of the modified layer non-present region of the base film with pure water, an angle exceeding 90° is preferable. As average thickness of the modified layer, thickness of 400 nm or less is preferable.
申请公布号 JP2015115422(A) 申请公布日期 2015.06.22
申请号 JP20130255503 申请日期 2013.12.10
申请人 SUMITOMO ELECTRIC PRINTED CIRCUIT INC ; SUMITOMO ELECTRIC FINE POLYMER INC 发明人 KAMIDE KOICHI ; NAKABAYASHI MAKOTO
分类号 H05K1/02;H05K3/38 主分类号 H05K1/02
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