| 摘要 |
PROBLEM TO BE SOLVED: To provide a paste for forming an Ag base layer enabling an Ag base layer having excellent joining strength, conductivity and thermal conductivity to be formed on the surface of a copper layer made of cupper or copper alloy joined to a body to be joined out of a metal member having the copper layer. ! SOLUTION: The paste for forming an Ag base layer is provided which is used when the Ag base layer is formed on the surface of a copper layer made of copper or copper alloy joined to a body to be joined out of a metal member having the copper layer. The paste contains: Ag powder 11; powder 12 of Sn or Sn alloy; and acrylic resin 13 whose decomposition temperature in N2 atmosphere is 400°C or less. ! COPYRIGHT: (C)2015,JPO&INPIT |
