STACKED TRANSPARENT MATERIAL CUTTING WITH ULTRAFAST LASER BEAM OPTICS, DISRUPTIVE LAYERS AND OTHER LAYERS

摘要

A method of laser drilling, forming a perforation, cutting, separating or otherwise processing a material includes focusing a pulsed laser beam into a laser beam focal line, and directing the laser beam focal line into a workpiece comprising a stack including at least: a first layer, facing the laser beam, the first layer being the material to be laser processed, a second layer comprising a carrier layer, and a laser beam disruption element located between the first and second layers, the laser beam focal line generating an induced absorption within the material of the first layer, the induced absorption producing a defect line along the laser beam focal line within the material of the first layer. The beam disruption element may be a beam disruption layer or a beam disruption interface.

主权项

1. A method of laser processing comprising:
forming a laser beam focal line in a workpiece, the laser beam focal line being formed from a pulsed laser beam, the workpiece comprising: a first layer, a second layer, and a beam disruption element located between the first and second layers; and the laser beam focal line generating an induced absorption within the first layer, the induced absorption producing a defect line along the laser beam focal line within the first layer.