TRANSFER MOLDING METHOD, MOLD, AND MOLDED ARTICLE

摘要

There is provided a molding method for efficiently and accurately molding a hollow part of a thermosetting resin with a simple mechanism, a mold, and a molded article. A mold used for molding of a thermosetting resin includes an upper mold, an intermediate mold, and a lower mold which can be stacked with each other. Primary molding for molding segment parts and secondary molding for bonding the segment parts are sequentially performed by placing or retracting the intermediate mold to switch between a runner for primary molding and a runner for secondary molding.

主权项

1. A molding method for molding a thermosetting resin, the method comprising:
a first mold clamping step, wherein an upper mold and a lower mold are clamped with an intermediate mold placed therebetween to form a first chamber, a first cavity and a first runner for primary molding between the upper mold and the intermediate mold, and a second cavity and a second runner for primary molding between the lower mold and the intermediate mold; a primary molding step, wherein a first molding material is transferred into the first cavity from the first chamber, through the first runner for primary molding, to form a first segment part, and the first molding material is transferred into a second cavity formed by fitting the lower mold to the intermediate mold, through the second runner for primary molding, to form a second segment part; a second mold clamping step, wherein the intermediate mold placed between the upper mold and the lower mold is retracted, and the upper mold and the lower mold are clamped, so as to form a second chamber serving as a portion of the first chamber, a third cavity surrounded by at least a portion of the first segment part and a portion of the second segment part, and a runner for secondary molding which is in communication with the third cavity; and a secondary molding step, wherein a second molding material is transferred into the third cavity from the second chamber through the runner for secondary molding to bond the first segment part and the second segment part.