CONFIGURABLE TEST EQUIPMENT

摘要

An electronic component test device capable of testing electronic components in a plurality of test configurations. The device includes a probe head for providing a plurality of probe contact structures to an electronic component to be tested. The device includes an interconnect board coupled to the probe head. The interconnect board includes a plurality of conductive terminals, each of a first subset of the plurality of conductive terminals is coupled to one of a group of electrical signal lines for coupling to different types of external signals. The interconnect board includes a plurality of conductive lines. Each conductive line is coupled between a corresponding one of a plurality of conductive terminals in a second subset of the plurality of conductive terminals and a terminal for coupling to one of the plurality of probe contact structures. Each conductive terminal of the second subset is couplable by an interconnector of a plurality of interconnectors to a conductive terminal of multiple conductive terminals of the first subset based on a test configuration of the device.

主权项

1. An electronic component testing device capable of testing electronic components in a plurality of test configurations, comprising:
a probe head for providing a plurality of probe contact structures to an electronic component to be tested; an interconnect board coupled to the probe head, the interconnect board including:
a plurality of conductive terminals, each of a first subset of the plurality of conductive terminals is coupled to one of a group of electrical signal lines for coupling to different types of external signals;a plurality of conductive lines, each conductive line of the plurality is coupled between one of a plurality of conductive terminals in a second subset of the plurality of conductive terminals and a terminal for coupling to one of the plurality of probe contact structures; andwherein each conductive terminal of the second subset is couplable by an interconnector of a plurality of interconnectors to a conductive terminal of multiple conductive terminals of the first subset based on a test configuration of the device.