METHOD FOR PRODUCING CONDUCTIVE TRACKS

摘要

The invention forms conductive tracks in electronics and microelectronics for the commutation of electronic circuits and semiconductor devices. The method for producing conductive tracks includes applying continuous metallization layers to a non-conductive substrate, forming a metallization pattern, and applying to the formed tracks a protective barrier layer and a layer for soldering and/or welding elements of parts to the conductive tracks. The continuous metallization layers are applied by consecutively applying an adhesive layer, a conductive layer, and a metal layer, acting as a mask, to the non-conductive substrate. To form the metallization pattern, a mask is formed by laser ablation on sections of the metal layer not occupied by conductive tracks, then selective chemical etching removes the conductive layer and adhesive sublayer from the exposed sections, and selective chemical etching removes the mask, after which the protective barrier layer and layer for soldering and/or welding are applied.

主权项

1. A method for producing conducting tracks, comprising the steps of:
applying continuous metallization layers onto a non-conductive substrate; forming a metallization pattern comprising tracks and conductive tracks; and applying a protective barrier layer onto the formed tracks and applying an attachment layer for element parts onto the formed conductive tracks, said element parts being one of a group consisting of soldered, welded, or both by said attachment layer, wherein the step of applying continuous metallization layers comprises: successively applying an adhesion sub-layer, a conductive layer and a metal layer serving as a mask onto the non-conductive substrate, and wherein the step of forming a metallization pattern, comprises:
forming a mask by laser ablation on regions of a metal layer, said metal layer serving as the mask and said regions not occupied by the conductive tracks;removing the conductive layer and the adhesion sub-layer in opened regions by selective chemical etching;removing the mask by selective chemical etching; andapplying the protective barrier layer and the attachment layer.