| 发明名称 |
POWER DELIVERY TO THREE-DIMENSIONAL CHIPS |
| 摘要 |
The present disclosure includes a three dimensional (3D) integrated device comprising a first die having a first supply line and a second die having a second supply line, a power header, and voltage selection logic. The power header is connected to the first die and the second die and configured to generate a first voltage on a first voltage line and a second voltage on a second voltage line. The voltage selection logic is connected to the first supply line and the second supply line and configured to select between the first voltage line and the second voltage line for each of the first supply line and the second supply line. |
| 申请公布号 |
US2015168972(A1) |
申请公布日期 |
2015.06.18 |
| 申请号 |
US201314132506 |
申请日期 |
2013.12.18 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
Mathiyalagan Vijay A.;Pullelli Siva Rama K.;Sethuraman Saravanan;Wright Kenneth L. |
| 分类号 |
G05F1/625;G11C5/14 |
主分类号 |
G05F1/625 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A three dimensional (3D) integrated device, comprising:
a first die having a first supply line; a second die having a second supply line; a power header connected to the first die and the second die and configured to generate a first voltage on a first voltage line and a second voltage on a second voltage line; voltage selection logic connected to the first supply line and the second supply line and configured to select between the first voltage line and the second voltage line for each of the first supply line and the second supply line. |
| 地址 |
Armonk NY US |
