BETA-AMINO ACID COMPRISING PLATING FORMULATION

摘要

A plating formulation for the electroless deposition of a metal layer on a substrate, wherein a β-amino acid and/or β-amino acid derivative is used as a stabilizer. The β-amino acid is present within a range of 1 mg/L to 2 g/L. Typically, the electrolyte is free of heavy metal stabilizers, cyanides, selenium compounds and sulfur compounds comprising sulfur in an oxidation state between −2 and +5. The inventive plating formulation can comprise 3-aminopropionic acid, 3-aminobutyric acid, 3-amino-4-methylvaleric acid, and 2-aminoethane-sulfonic acid.

主权项

1. A plating formulation comprising a metal ion source for a metal to be deposited, a reducing agent, a complexing agent, an accelerator, and a β-amino acid and/or β-amino acid derivative as stabilizer, wherein the β-amino acid is present within a range of 1 mg/L to 2 g/L.