| 摘要 |
PROBLEM TO BE SOLVED: To provide a photocurable resin composition in which moisture absorption property can be suppressed and cold-heat cycle resistance can be improved in a cured product thereof when used for a printed wiring board or the like, without decreasing migration-resistant property.SOLUTION: The photocurable resin composition comprises a carboxyl group-containing resin, an oxime ester-based photopolymerization initiator represented by general formula (I) below, a block isocyanate compound, and a maleimide compound. In the formula, Rrepresents a hydrogen atom, a phenyl group, an alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 5 to 8 carbon atoms, an alkanoyl group having 2 to 20 carbon atoms, or a benzoyl group; and Rrepresents a phenyl group, an alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 5 to 8 carbon atoms, an alkanoyl group having 2 to 20 carbon atoms, or a benzoyl group. |
