EDGE CHAMFERING METHODS

摘要

Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary shape using lasers are described herein. Three general methods to produce chamfers on glass substrates are disclosed. The first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser. Treatment with the ultra-short laser may be optionally followed by a CO2 laser for fully automated separation. The second method is based on thermal stress peeling of a sharp edge corner, and it has been demonstrated to work with different combination of an ultrashort pulse and/or CO2 lasers. A third method relies on stresses induced by ion exchange to effect separation of material along a fault line produced by an ultra-short laser to form a chamfered edge of desired shape.

主权项

1. A method of laser processing comprising:
focusing a pulsed laser beam into a laser beam focal line; directing the laser beam focal line into a material at a first angle of incidence to the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material; translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines along a first plane at the first angle within the material; directing the laser beam focal line into the material at a second angle of incidence to the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material; and translating the material or the laser beam relative to one another, thereby forming a plurality of defect lines along a second plane at the second angle within the material, the second plane intersecting the first plane.