COPPER ALLOY FOR ELECTRONIC/ELECTRIC DEVICE, COPPER ALLOY PLASTIC WORKING MATERIAL FOR ELECTRONIC/ELECTRIC DEVICE, AND COMPONENT AND TERMINAL FOR ELECTRONIC/ELECTRIC DEVICE

摘要

This copper alloy for an electronic/electric device contains Mg in a range of 3.3-6.9 atomic%, with the remainder substantially being Cu and unavoidable impurities, and has a strength ratio (TSTD/TSLD) exceeding 1.02, with this strength ratio being calculated from the strength TSTD when a tension test is performed in a direction orthogonal to the rolling direction and the strength TSLD when a tension test is performed in the direction parallel to the rolling direction.