| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a laser processing device capable of cutting a workpiece having a thickness by using a laser with a wavelength shorter than that of CO<SB POS="POST">2</SB>laser, and also to obtain a laser processing method. <P>SOLUTION: A laser beam (YAG based laser with a wavelength shorter than that of the CO<SB POS="POST">2</SB>laser) for cutting the workpiece 30 is emitted by a laser emitting part 24, and the laser beam is condensed so that the energy distribution of the laser beam emitted from the laser emitting part 24 by an optical system 26 is deviated in an advancing direction of cutting the workpiece 30 at the position of the workpiece 30. Accordingly, the laser beam can be condensed so that the power of the laser beam is consumed by temperature increase of molten metal, and the molten metal temperature can be increased to a high temperature. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
