| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a handling mechanism of a probe card which enables handling work without being affected by heat even immediately after test under high temperature or low temperature. <P>SOLUTION: Provided is a handling mechanism 25 for handling a probe card 17 including a plurality of probes 18. The mechanism includes a handle 26 which is attached to the probe card 17 and used when the probe card 17 is handled, and an attaching/detaching mechanism 27 which detachably attaches the handle 26 to the probe card 17. The handle 26 can be installed to any of the plurality of probe cards 17. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
