发明名称 基板処理装置及び基板処理方法
摘要 <p>The invention provides a substrate processing device and a substrate processing method which make solution printed on a substrate solidify at once. The substrate processing device comprises a supporting member (100), coating unit components (200), and solidifying unit (300). The supporting member (100) is used to configure the substrate. The coating unit components (200) comprise a coating unit (200a) which coat solution on the substrate. The solidifying unit (300) is jointed in a manner of being capable of moving towards two sides of the supporting member (100), and provides suction pressure for the solution coated on the substrate. The coating unit (200a) comprises a coating transfer component (201a) and a coating component (205a). The coating transfer component (201a) is jointed in a manner of being capable of moving towards two sides of the supporting member (100). The coating component (205a) is jointed with the coating transfer component (201a), and coats solution on the substrate in an ink-jet printing manner.</p>
申请公布号 JP5735569(B2) 申请公布日期 2015.06.17
申请号 JP20130073616 申请日期 2013.03.29
申请人 发明人
分类号 H05B33/10;B05D1/26;B05D3/12;H01L51/50 主分类号 H05B33/10
代理机构 代理人
主权项
地址
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