THE BONDING METHOD FOR ELECTRONIC COMPONENTS AND THE ELECTRONIC DEVICES BY USING THAT
摘要
<p>The present invention relates to a method for gluing electronic components having improved adhesion including: a step of preparing a printed circuit board; a step of spreading photo-alignment polymers on electronic component adhesion areas on the printed circuit board; a step of orienting the photo-alignment polymers by radiating UV rays; a step of spreading glue on the photo-alignment polymers; and a step of mounting the electronic components on the glue.</p>
