发明名称 |
Electronic component built-in substrate |
摘要 |
An electronic component built-in substrate, includes a lower wiring substrate, an electronic component mounted on the lower wiring substrate, an intermediate wiring substrate including an opening portion in which the electronic component is mounted, and arranged in a periphery of the electronic component, and connected to the lower wiring substrate via a first conductive ball, an upper wiring substrate arranged over the electronic component and the intermediate wiring substrate, and connected to the intermediate wiring substrate via a second conductive ball, and a resin filled into respective areas between the lower wiring substrate, the intermediate wiring substrate, and the upper wiring substrate, and sealing the electronic component, wherein the first conductive ball and the second conductive ball are arranged in displaced positions mutually. |
申请公布号 |
US9059088(B2) |
申请公布日期 |
2015.06.16 |
申请号 |
US201313944188 |
申请日期 |
2013.07.17 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
Kurashima Nobuyuki;Koyama Tetsuya;Ilzuka Hajime;Tanaka Koichi |
分类号 |
H01L23/48;H01L23/52;H01L29/40;H01L23/02;H01L23/12;H01L23/28;H01L23/498;H01L21/56;H05K1/14;H01L23/31;H01L23/00;H01L25/16 |
主分类号 |
H01L23/48 |
代理机构 |
Kratz, Quintos & Hanson, LLP |
代理人 |
Kratz, Quintos & Hanson, LLP |
主权项 |
1. An electronic component built-in substrate, comprising:
a lower wiring substrate; an electronic component mounted on the lower wiring substrate; an intermediate wiring substrate including an opening portion in which the electronic component is mounted, and arranged in a periphery of the electronic component, and connected to the lower wiring substrate via a first conductive ball; an upper wiring substrate arranged over the electronic component and the intermediate wiring substrate, and connected to the intermediate wiring substrate via a second conductive ball; and a resin filled into respective areas between the lower wiring substrate, the intermediate wiring substrate, and the upper wiring substrate, and sealing the electronic component, wherein the first conductive ball and the second conductive ball are arranged in displaced positions mutually, and the first conductive ball and the second conductive ball are arranged in positions that are not overlapped mutually, when viewed from a top. |
地址 |
Nagano-shi JP |