| 摘要 |
The present invention relates to a substrate processing apparatus capable of excellently processing a substrate by increasing uniformity of temperature if the substrate is processed with processing fluid with a temperature different from the temperature of a surface of a substrate. According to the present invention, a first nozzle (24), while moving to an outer side of the substrate (3) toward a predetermined position (an entire area finishing treatment position (P5)) of an outer circumferential portion of a substrate (3) from a predetermined position, an entire area treatment starting position (P2), of a central portion of the substrate (3), processes the substrate (3) by discharging processing fluid with a temperature different from the temperature of a surface of the substrate (3). After the first nozzle (24) is moved to an inner circumferential side of the substrate (3) toward a predetermined position, an outer circumferential area treatment starting position (P6) of an outer circumferential side from the entire area treatment starting position (P2), while the first nozzle (24) moves to an outer circumferential side of the substrate (3) toward a predetermined position (an outer circumferential area treatment stop position (P7)) of the substrate (3) from the outer circumferential area treatment starting position (P6), a substrate outer circumferential area treatment for processing the substrate (3) is performed by discharging processing fluid toward the substrate (3) from the first nozzle (24). |
