| 摘要 |
A sensor device includes a first substrate of a semiconductor material having first and second surfaces facing the opposite sides, multiple photodetectors configured to receive light impinging on the first surface, and multiple first contact pads each exposed at both the first and second surfaces and electrically coupled to at least one of the multiple photodetectors. A second substrate comprises first and second surfaces facing the opposite sides, electrical circuits, multiple second contact pads each disposed at the first surface of the second substrate and electrically coupled to at least one of the electrical circuits, and a plurality of cooling channels formed of first trenches extending into the second surface of the second substrate but not reaching the first surface of the second substrate. The second surface of the first substrate is mounted to the first surface of the second substrate such that each of the first contact pads is electrically coupled to at least one of the second contact pads. |
